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<h1>Over-molding replaces both housing and potting, encapsulating in just one
operation. </h1>
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<p> </p>
<p>Seal large PC boards with external connectors</p>
</td>
<td valign="middle" align="center"><img src="nf_images/app_encap1.jpg" width="269" height="128" alt="connector molding"></td>
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<td width="50%" valign="middle" align="right">Encapsulation of sensitive electronics<br>
prior to conventional over-molding</td>
<td valign="middle" align="center"><img src="nf_images/app_encap2.jpg" width="269" height="141" alt="hot melt molding"></td>
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<td width="50%" valign="middle" align="right">Over-mold densely populated
PCB packages</td>
<td valign="middle" align="center"><img src="nf_images/app_encap3.jpg" width="269" height="116" alt="electronics packaging"></td>
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<td width="50%" valign="middle" align="right">Packaging of sensitive high
performance electronics</td>
<td valign="middle" align="center"><img src="nf_images/app_encap4.jpg" width="268" height="161" alt="connector molding"></td>
</tr>
</table>
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